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US Patent Issued to Wolfspeed on Oct. 20 for "Thermal management enhancement of electronic components" (Arizona Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,368, issued on Oct. 20, was assigned to Wolfspeed Inc. (Durham, N.C.). "Thermal management enhancement of electronic components" was invent... Read More


US Patent Issued to MEIKO ELECTRONICS on Oct. 20 for "Device embedded substrate and manufacturing method of same" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,369, issued on Oct. 20, was assigned to MEIKO ELECTRONICS Co. LTD. (Ayase, Japan). "Device embedded substrate and manufacturing method of s... Read More


US Patent Issued to ZKW Group on Oct. 20 for "Printed circuit board arrangement for a motor vehicle headlight" (Austrian Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,370, issued on Oct. 20, was assigned to ZKW Group GmbH (Wieselburg, Austria). "Printed circuit board arrangement for a motor vehicle headli... Read More


US Patent Issued to ASUSTek COMPUTER on Oct. 20 for "Heat dissipation module" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,371, issued on Oct. 20, was assigned to ASUSTek COMPUTER INC. (Taipei City, Taiwan). "Heat dissipation module" was invented by Po-Ting Chen... Read More


US Patent Issued on Oct. 20 for "Shieldable circuit board structure" (Taiwanese Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,372, issued on Oct. 20. "Shieldable circuit board structure" was invented by Chen-Wei Su (Taipei City, Taiwan). According to the abstract*... Read More


US Patent Issued to Infineon Technologies on Oct. 20 for "Semiconductor module and method for fabricating a semiconductor module" (Austrian, German Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,373, issued on Oct. 20, was assigned to Infineon Technologies AG (Neubiberg, Germany). "Semiconductor module and method for fabricating a s... Read More


US Patent Issued to HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO), AVARY HOLDING (SHENZHEN), GARUDA TECHNOLOGY on Oct. 20 for "Circuit board having a switch and method for fabricating the same" (Chinese Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,374, issued on Oct. 20, was assigned to HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) Co. LTD. (Hebei Province, China), AVARY HOLDING (SHE... Read More


US Patent Issued to SAMSUNG ELECTRO-MECHANICS on Oct. 20 for "Printed circuit board" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,375, issued on Oct. 20, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea). "Printed circuit board" was invented by... Read More


US Patent Issued to LOTTE ENERGY MATERIALS CORPORATON on Oct. 20 for "Surface-treated copper foil with heat resistance, and copper clad laminate and printed wiring board including the same" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,376, issued on Oct. 20, was assigned to LOTTE ENERGY MATERIALS CORPORATON (Jeollabuk-do, South Korea). "Surface-treated copper foil with he... Read More


US Patent Issued to SAMSUNG ELECTRO-MECHANICS on Oct. 20 for "Printed circuit board and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,377, issued on Oct. 20, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea). "Printed circuit board and method of ma... Read More